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Ultra-compact vacuum high-power reflow furnace (TR-125VH3)

The ultra-compact vacuum high-power reflow furnace (TR-125VH3) has arrived in the world's smallest class of reflow furnace series!

The ultra-compact vacuum high-power reflow furnace (TR-125VH3) from Taisei Corporation has a heating speed that is three times faster than our conventional models! (21℃/min) By combining it with a cooling reflow plate, cooling performance is enhanced! It prevents oxidation in a vacuum or nitrogen atmosphere, allowing for high-quality soldering, and due to low-temperature heating, it prevents deterioration and distortion of components. It eliminates the need for flux and cleaning agents, leading to cost reduction and lower environmental impact. This is an essential unit for researchers and developers pursuing cutting-edge technology, as it enhances development and accelerates development speed.

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